NXP's SOT669 Loss Free PAcKage (LFPAK) offers outstanding thermal performance from the compact footprint of the SO8. Originally designed for use in DC/DC converter applications, it allows heat to be dissipated much more easily, maintaining the lowest possible operating temperatures. The range of PowerMOS devices available in LFPAK has been recently expanded with smaller, more-efficient products optimized for a number of new applications including notebook computers, desktops and servers.
Furthermore, the LFPAK has an extremely low profile - at 1.1 mm thick it is 40% thinner than SO8. And its innovative internal construction gives it an inductance considerably lower than comparable packages, which makes LFPAK the perfect choice for high-frequency applications such as mobile phones.
Thermal properties
In a traditional power package, the main thermal pathway is vertically down through the mounting and into the PCB. However, the LFPAK also dissipates a significant amount of power upwards through the top of the package, giving it thermal resistances significantly lower than SO8 and comparable with much larger packages such as D²PAK and DPAK.
Key features
- Virtually zero package resistance
- Low thermal resistance to the board
- Enhanced power handling
- Low inductance - just 1.1 nH
Key applications
- DC/DC converters
- Notebook computers
- Desktop computers and servers
- High-frequency applications
New products
PH2520U - 20 V N-channel MOSFET- PH2925U - 25 V N-channel MOSFET
- PH3230S - 30 V N-channel MOSFET
- PH3830L - 30 V N-channel MOSFET
- PH7030L - 30 V N-channel MOSFET
- PH8230E - 30 V N-channel MOSFET
