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OM13495
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Surface Mount to DIP Evaluation Board.
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The OM13495 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13495 supports the following packages: TSSOP24, (SOT355), TSSOP20, (SOT360), TSSOP16, (SOT403), TSSOP14, (SOT402).
Surface Mount to DIP Evaluation Board.
Distributor Name | 地域 | 在庫 | 在庫日付 |
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Upon selection of a preferred distributor, you will be directed to their web site to place and service your order. Please be aware that distributors are independent businesses and set their own prices, terms and conditions of sale. NXP makes no representations or warranties, express or implied, about distributors, or the prices, terms and conditions of sale agreed upon by you and any distributor.
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